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1 Chip Scale Packaging
Electronics: CSPУниверсальный русско-английский словарь > Chip Scale Packaging
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2 Chip-Scale Packaging
Information technology: CSPУниверсальный русско-английский словарь > Chip-Scale Packaging
См. также в других словарях:
Chip scale package — A chip scale package (CSP) (sometimes, chip scale package with a hyphen) is a type of integrated circuit chip carrier. Originally, CSP was the acronym for chip size packaging. Since only a few packages are chip size, the meaning of the acronym… … Wikipedia
Chip carrier — A standard sized 8 pin dual in line package (DIP) containing a 555 timer IC. A chip carrier, also known as a chip container or chip package, is a container for a transistor or an integrated circuit. The carrier usually provides metal leads, or… … Wikipedia
Wafer-scale integration — Wafer scale integration, WSI for short, is a yet unused system of building very large integrated circuit networks that use an entire silicon wafer to produce a single super chip . Through a combination of large size and reduced packaging, WSI… … Wikipedia
Computer-Chip — Integrierter Schaltkreis. Das Chip Gehäuse wurde geöffnet und ermöglicht den Blick auf den eigentlichen Halbleiter. Die erkennbaren Strukturen im Zentrum sind die realisierte elektronische Schaltung. Im Außenbereich sind die goldenen… … Deutsch Wikipedia
Three-dimensional integrated circuit — In electronics, a three dimensional integrated circuit (3D IC, 3D IC, or 3 D IC) is a chip in which two or more layers of active electronic components are integrated both vertically and horizontally into a single circuit. The semiconductor… … Wikipedia
Thermal copper pillar bump — The Thermal Copper Pillar Bump, also known as the thermal bump , is a thermoelectric device made from thin film thermoelectric material embedded in flip chip interconnects (in particular copper pillar solder bumps) for use in electronics and… … Wikipedia
XDA Flame — The XDA Flame is a PocketPC device (also called PDA or Personal Digital Assistant) first released in May 2007, manufactured by [http://www.arimacomm.com.tw/english/index02.asp Arima Communications] and originally distributed by… … Wikipedia
CSP — Communicating Sequential Processes (Computing » Networking) **** Chip scale package (Academic & Science » Electronics) *** Community Safety Partnership (Governmental » Police) *** Cryptographic Service Provider (Governmental » Military) ***… … Abbreviations dictionary
CSP — agricult. abbr. Concentrated Super Phosphate comp. abbr. Control Switching Point abbr. Centro Supercacolo Piemonte (organization, Italien, HPC) abbr. Chip Scale Package (IC) abbr. Communicating Sequential Processes abbr. Cross System Product… … United dictionary of abbreviations and acronyms
Camtek Intelligent Imaging — Camtek Ltd. (NASDAQ, TASE: CAMT) (http://www.camtek.co.il) is an Israel based manufacturer of automated optical inspection (AOI) systems and related products. Products are used by semiconductor fabs, test and assembly houses, and… … Wikipedia
Bahgat G. Sammakia — is an Egyptian American mechanical engineer. He is currently a professor of mechanical engineering and director of both the Integrated Electronics Engineering Center and the Small Scale Systems Packaging Center at Binghamton University a part of… … Wikipedia